I have been in the manufacturing industry for more than 5 years after graduated with a Bachelor's degree in Chemical Engineering. I started off as a plating process engineer. Then, 3 years+ as a process engineer in semiconductor backend, currently a quality engineer in the automotive industry.


  • Quality Engineer

    at Sensata Technologies - Subang Jaya

    January 2019 - at Present


    • Lead 8D investigation based on complaints/ returns and assist in the development, implementation, monitoring of corrective actions. • Support in maintaining documentation, which includes review, write and execute work instruction changes and manual revisions. • Contribute to various manufacturing projects, such as cost reduction, production automation, and machine re-layout. Experience gained: • knowledge of SQL data query and Minitab data analysis • application of DMAIC • exposure on PPAP • overview of general ASIC upstream processes (PCB level and sensor level) • working with cross-functional team (design engineers, process and equipment engineers, failure analysis engineers)

  • Process Engineer

    at Infineon Technologies - Melaka

    August 2015 - December 2018


    • Lead machine qualification on Backend EOL equipment based on automotive customer's criteria. - Criteria include: Package Outline measurement Cpk, Delamination Check(SAT 0hr), Micro-crack check(magnification & dye penetration) • Spearhead discussions with customer on technical challenges faced involving their product lines: - Topics include: Quality improvement, Documentation, Lot yield deviation handling - Activities include: Weekly Teleconference with Customer, Technical workshop, Customer line audit • Initiate and oversee investigations and improvements in products which trigger yield loss limit (product lots which fall less than 95% yield) -Methodologies used: 5-whys, is-and is-not, process mapping -Steps include: Root cause analysis, preventive, containment, and corrective actions Experience gained: - Application of problem-solving and statistical tools - Over-view of backend processes, esp. EOL processes - Exposure on EOL defects - Backend EOL processes

  • Process Engineer

    at Sumiden Electronic Materials - Shah Alam

    July 2014 - July 2015


    • Design and evaluate process parameters based on customer requirements • Process yield and cost sustaining through: -Monthly material consumption review -Daily chemical concentration monitoring and dozing optimization • Initiate and evaluate cost reduction projects on the plating bath: -Chemical drag-out recovery system to reduce chemical losses. • Actively involved in root cause investigation on any quality issues faced (defects): -Troubleshoot process-related plating defects during buy-off -Aid in 8D report preparation related to customer complaints Experience gained: - plating related defects: discoloration, peel-off, cracking, thickness out of spec. - plating process overview with a focus on nickel plating - sub-processes: material drawing, bunching - FMEA, PDCA, 8D, control charts, checksheets application exposure


  • Bachelor's Degree in Engineering in Chemical

    at University at Buffalo, SUNY

    2011 - 2013 (2 years) New York

  • American Degree Transfer Program

    at Inti College Subang Jaya

    2009 - 2010 (1 year) Selangor


  • English Negotiation

  • Chinese Negotiation

  • Malay Negotiation