Job description

Requirements

  • Entry level
  • No Education
  • Salary to negotiate
  • Shanghai

Description

The NVM Solutions Group (NSG) is seeking a Sr. Packaging Development Engineer for the development of Non-Volatile Memory package. In this role you will manage packaging technology development, lead assembly team on technical problem solving, define packaging technology strategy, and work with cross-functional teams including fab TD, fab/assembly factory, Intel Asia assembly team, subcon packaging team, QRE to integrate next generation silicon into assembly packaging. In this position, you will create assembly test chip definition, assess packaging and reliability risk, provide FMEA, and guide team on risk mitigation plan. This role also provides opportunity for support of system in package and advanced packaging path finding programs.

Qualifications

Minimum Requirements:
Education: Bachelor with 12+ years or MS/Ph.D. in an engineering field with 8+ years' industry experience focusing on assembly technology development
Minimum of 10 years of experience in electronic packaging development
Minimum of 8 years of experience of assembly/Si interaction, substrate process, packaging material, and failure mechanism analysis

Preferred skills:
Strong technical problem solving skills on packaging development.
Strong knowledge of Si fab back end/far back end material/process and Si/packaging interaction.
Ability to work in a fast paced environment while managing changing priorities.
Strong written and verbal communication skills.
Flexibility in working with Asia and US time zones.
Flexibility and ability to cope with and resolve ambiguity.

Inside this Business Group
Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

About the company

Intel is a place where employees can pursue their passions, support world-changing initiatives, and thrive intellectually.

Our employees are as diverse as our customers, vendors, and colleagues in the global market. This worldwide perspective helps us anticipate, and provide for, the growing needs of a changing marketplace. Here are a few examples:

The collaboration of Intel teams halfway across the world from each other was key to the development of our Intel® Centrino® processor technology.

The leaders of our Technology and Manufacturing Group use diversity to broaden team perspective on projects.

Our International Summit for Proliferating Ideas and Recognizing Excellence lets innovators from every country within Intel Corporate Services share ideas.

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