Job description


  • Entry level
  • No Education
  • Salary to negotiate
  • Hillsboro


Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment. In this position, the engineer will focus integration of packages on platform board design solutions. Emphasis of board level design, technology development, and integration.


The ideal candidate should exhibit the following behavioral traits: 

Interest and motivation to develop innovative solutions in a challenging and dynamic environment
Analytical and problem solving skills
Verbal and written communication skills
Willingness to travel (when required)
A self-starter, highly motivated, team player


You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship.


This is an entry level position and will be compensated accordingly. 

Candidate must have a Bachelor’s or Masters degree in Electrical Engineering or Mechanical Engineering .
Minimum of 3 years of experience with PCB layout utilizing Cadence Allegro and Cadence Constraint Manager (v16.5 or later)
Minimum of 3 years of experience with hardware development including: schematic entry, signal integrity practices and theories, constraint entry, library creation, DFM
Minimum of 2 years of experience managing highly complex PCB designs both individually as well as part of a team while working across multiple sites.

Additional Preferred Qualifications:

Minimum of 6 months of experience with a broad range of PCB form factors.
Minimum of 6 months of experience with HDI / Type4 PCB design.
Previous experience managing external CAD contract workers to meet project demands .
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

About the company

Intel is a place where employees can pursue their passions, support world-changing initiatives, and thrive intellectually.

Our employees are as diverse as our customers, vendors, and colleagues in the global market. This worldwide perspective helps us anticipate, and provide for, the growing needs of a changing marketplace. Here are a few examples:

The collaboration of Intel teams halfway across the world from each other was key to the development of our Intel® Centrino® processor technology.

The leaders of our Technology and Manufacturing Group use diversity to broaden team perspective on projects.

Our International Summit for Proliferating Ideas and Recognizing Excellence lets innovators from every country within Intel Corporate Services share ideas.

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