Job description

Requirements

  • Entry level
  • No Education
  • Salary to negotiate
  • Phoenix

Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

Substrate Packaging Technology Development (SPTD) is looking to hire an engineer to join a team tasked with developing and ramping advanced organic substrate and packaging technologies via an internal pathfinding, technology development, and low volume manufacturing line. As a Packaging R&D Engineer in Module Engineering, you will be required to develop material characterization and process technology in the SPTD Lithography Area. This 'hands-on' position will require a significant amount of time spent on the factory floor to develop new process technology and characterization of new materials. Since this will involve startup of new manufacturing capability for Intel, a high tolerance of ambiguity and flexibility with respect to job roles is desired.

The ideal candidate should exhibit the following:
- Strong interest in hands-on work with process equipment
- Solid theoretical and practical understanding in materials characterization
- Excellent listening, written and verbal communication skills
- Demonstrated problem solving and analytical skills
- Demonstrated capability of working and excelling in a high performing team environment


Qualifications

Minimum Qualifications:
- Ph.D. in a relevant science or engineering field (Mechanical Engineering, Chemical Engineering, Materials Science, Physics).

Preferred Qualifications:
- Hands-on equipment development experience
- Expertise relevant to microfabrication and/or integrated circuit packaging
- Hands-on experience in lamination tools and photolithography


Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

  • ms project

About the company

Intel is a place where employees can pursue their passions, support world-changing initiatives, and thrive intellectually.

Our employees are as diverse as our customers, vendors, and colleagues in the global market. This worldwide perspective helps us anticipate, and provide for, the growing needs of a changing marketplace. Here are a few examples:

The collaboration of Intel teams halfway across the world from each other was key to the development of our Intel® Centrino® processor technology.

The leaders of our Technology and Manufacturing Group use diversity to broaden team perspective on projects.

Our International Summit for Proliferating Ideas and Recognizing Excellence lets innovators from every country within Intel Corporate Services share ideas.